计及流-热耦合热网络模型的IGBT结温计算*

doi:10.11985/2022.02.003

电气工程学报 ›› 2022, Vol. 17 ›› Issue (2): 19-26.doi: 10.11985/2022.02.003

• 特邀专栏:电气化交通中的电能变换与利用新技术 • 上一篇下一篇

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计及流-热耦合热网络模型的IGBT结温计算^*

许智亮¹(), 葛兴来¹(), 李金¹, 柯倩霞¹, 朱丹²

1.西南交通大学电气工程学院成都 611756
2.中车大连机车车辆有限公司大连 116022

收稿日期:2022-02-28 修回日期:2022-05-15 出版日期:2022-06-25 发布日期:2022-08-08
通讯作者: 葛兴来 E-mail:xzl@my.swjtu.edu.cn;xlgee@163.com
作者简介:许智亮,男,1999年生,硕士研究生。主要研究方向为功率变流器中IGBT器件可靠性。E-mail： xzl@my.swjtu.edu.cn
基金资助:
*高铁联合基金重点(U1934204);四川省科技计划(2021YJ0027)

Calculation of IGBT Junction Temperature with Thermal Network Model Considering Flow-thermal Coupling

XU Zhiliang¹(), GE Xinglai¹(), LI Jin¹, KE Qianxia¹, ZHU Dan²

1. School of Electrical Engineering, Southwest Jiaotong University, Chengdu 611756
2. CRRC Dalian Co., Ltd., Dalian 116022

Received:2022-02-28 Revised:2022-05-15 Online:2022-06-25 Published:2022-08-08
Contact: GE Xinglai E-mail:xzl@my.swjtu.edu.cn;xlgee@163.com

摘要/Abstract

摘要：

绝缘栅双极型晶体管(Insulated gate bipolar transistor,IGBT)的结温计算对于评估其剩余寿命、保障电力电子变换器可靠运行具有重要意义。传统的热网络法忽略了模块与散热器之间真实的传热过程,难以准确有效计算结温变化,为此,提出一种计及流-热耦合的热网络模型的IGBT结温计算方法。该方法通过考虑流-热耦合的有限元仿真提取得到IGBT模块与散热器的热网络模型,根据易于获取的散热器水温作为温度参考点计算IGBT结温。为验证模型有效性,搭建了功率循环加速老化试验平台提取结温变化曲线。结果表明,所提的热网络模型能够更加真实准确地计算IGBT结温,可以为实际应用中IGBT模块的可靠性评估、剩余寿命预测提供更加真实准确的结温变化数据。

关键词: IGBT, 结温计算, 热网络模型, 流-热耦合

Abstract:

The junction temperature calculation of insulated gate bipolar transistor(IGBT) is of great significance for evaluating its remaining life and ensuring the reliable operation of power electronic converters. The traditional thermal network method ignores the real heat transfer process between the module and the radiator, and it is difficult to calculate the junction temperature change accurately and effectively. To address this, a calculation method of IGBT junction temperature with thermal network model considering flow-thermal coupling is proposed. In this method, the thermal network model of IGBT module and the radiator is extracted by the finite element simulation considering the flow-thermal coupling, and the junction temperature of the IGBT is calculated based on the easily obtained radiator water temperature as the temperature reference point. In order to verify the validity of the model, a power cycle accelerated aging test platform is built to extract the junction temperature change curve. The results show that the proposed thermal network model can calculate the IGBT junction temperature more realistically and accurately. And it can provide more real and accurate junction temperature change data for the reliability evaluation and remaining life prediction of IGBT modules in practical applications.

Key words: IGBT, junction temperature calculation, thermal network model, flow-heat coupling

中图分类号:

TM46

许智亮, 葛兴来, 李金, 柯倩霞, 朱丹. 计及流-热耦合热网络模型的IGBT结温计算^*[J]. 电气工程学报, 2022, 17(2): 19-26.

XU Zhiliang, GE Xinglai, LI Jin, KE Qianxia, ZHU Dan. Calculation of IGBT Junction Temperature with Thermal Network Model Considering Flow-thermal Coupling[J]. Journal of Electrical Engineering, 2022, 17(2): 19-26.

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结构层	材料	长/mm	宽/mm
IGBT芯片	Si	7.24	6.90
二极管芯片	Si	5.55	5.55
IGBT焊层	Sn-Ag	7.24	6.90
二极管焊层	Sn-Ag	5.55	5.55
上铜层	Cu	28.5	25.8
绝缘衬板	Al₂O₃	30.65	28
下铜层	Cu	28.5	25.8
基板	Cu	91.4	31.4

材料	热导率/ [W/(m·K)]	密度/ (kg/m³)	常压比热容/ [J/(kg·K)]
Si	118	2 330	700
Sn-Ag	35	7 300	226
Cu	398	8 960	225
Al₂O₃	15	3 780	830
Al	237	2 700	897

热网络参数	流-热耦合仿真	瞬态热仿真
R₁/(K/W)	0.101 7	0.136
R₂/(K/W)	0.169 9	0.086 12
R₃/(K/W)	0.146 3	0.204 8
R₄/(K/W)	0.080 17	0.050 59
C₁/(J/K)	0.377	0.225 9
C₂/(J/K)	0.024 61	0.208 6
C₃/(J/K)	0.562 9	0.423 5
C₄/(J/K)	0.466 7	0.440 6

计及流-热耦合热网络模型的IGBT结温计算^*

Calculation of IGBT Junction Temperature with Thermal Network Model Considering Flow-thermal Coupling

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