Simulation Analysis of Temperature Field of Basin Insulator

doi:10.11985/2019.03.006

Abstract

Abstract:

In recent years, gas-insulated fully enclosed combined electrical appliances (GIS) have been rapidly promoted and applied in China. Basin insulators usually play an important role in it, and its quality affects the reliable operation of the entire system. Epoxy resin composites are often used to prepare pot insulators and require a curing reaction at elevated temperatures. Uneven distribution of the temperature field during the curing process can cause defects inside the basin insulator. Through the computer simulation technology, the finite element principle is used to simulate the whole process of the pot insulator in the curing process, and the temperature field distribution of the insulator during the curing process is analyzed. Finally, the correctness of the simulation model is verified by experiments on the solidification molding process of the basin insulator.

Key words: Basin-type insulator, temperature field distribution, finite element analysis, curing molding

CLC Number:

TM216

RUAN Zhiwei,KAN Chaohao,WANG Lei. Simulation Analysis of Temperature Field of Basin Insulator[J]. Journal of Electrical Engineering, 2019, 14(3): 41-46.

Figures/Tables 8

References 13

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